Wednesday, 14 October 2026

NETBOX LABS SIGNS NVIDIA, GRAFANA LABS PARTNERSHIPS

KUALA LUMPUR, Oct 14 (Bernama) -- NetBox Labs, which develops the network and data centre management software NetBox, has announced partnerships with NVIDIA and Grafana Labs, along with new platform capabilities, at its first NetBox Evolve conference.

“Today NetBox is used by companies like Arm, CoreWeave, Kaiser Permanente and JPMorgan Chase to build, run and grow their networks and infrastructure.

“We are seeing tremendous growth, with more than 90 per cent of the top neoclouds using NetBox to design and scale their AI data centres, and we expect NetBox to power more than 100 GW of AI data centre capacity by 2030,” said NetBox Labs chief executive officer and co-founder, Kris Beevers in a statement.

Under the NVIDIA partnership, NetBox is now a native source of truth for NVIDIA Configuration Manager (NVCM), the network orchestration component of NVIDIA DSX OS. It provides the data that drives automated configuration across NVIDIA-native cluster fabrics.

NetBox Labs and Grafana Labs have also released a free, open-source NetBox plugin in the Grafana catalogue. The plugin brings live infrastructure details, such as site, role, tenant, rack, owner and lifecycle, into Grafana dashboards and alerts. According to the companies, it requires no pipeline changes, avoids stale labels and adds no metric cost.

Separately, NetBox Labs’ open-source Orb platform now supplies network flow and packet telemetry to Grafana Cloud users.

NetBox Labs has also expanded its Infrastructure Intelligence Platform. NetBox Designs, now in public preview, provides reusable templates for designing sites, racks and IP plans for large-scale deployments.

NetBox Agents adds pre-built AI agents for tasks including change request review, compliance and data quality management, also in public preview. A fully managed NetBox Platform MCP Server, now generally available, lets customers’ own AI agents query and change infrastructure in plain language.

NetBox Analytics, which has added new ready-made dashboards, and NetBox Visual Explorer will become generally available in November.

-- BERNAMA

Tuesday, 13 October 2026

TOSHIBA LAUNCHES FOUR EFUSE ICS FOR LOW-VOLTAGE POWER PROTECTION

Toshiba: TCKE5 Series of small-package eFuse ICs supporting 1.7V low-voltage operation.



KUALA LUMPUR, Oct 13 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba), a supplier of advanced semiconductor and storage solutions, has launched four electronic fuses (eFuse ICs) under its TCKE5 Series, integrating multiple functions to protect power supply lines.

The new products operate over an input voltage range of 1.7 volts (V) to 5.5V and are housed in the compact SOT-353F (UFV) package. The lineup comprises four models: “TCKE501UA”, “TCKE501UL”, “TCKE502UA” and “TCKE502UL.” Shipments began on Oct 12.

According to Toshiba in a statement, the TCKE5 Series is the first in its eFuse IC lineup to support 1.8V power lines, making it suitable for low-voltage applications, including Secure Digital (SD) memory cards.

As electronic devices become smaller, more functional, and less power-intensive, demand for low-voltage power supplies has increased. Protection against overcurrent and short-circuit conditions is also essential to improve the reliability of low-voltage power lines.

The series comes in a compact, low-profile package that reduces printed circuit board (PCB) mounting area, supporting space-saving, high-density designs for wearable and Internet of Things (IoT) devices.

Alongside the short-circuit protection offered by physical fuses, such as glass tube and chip current fuses, the TCKE5 Series features overcurrent protection that shuts off output when excessive current is detected.

The overcurrent protection function also includes a mask time to help prevent unnecessary shutdowns caused by transient peak currents, thus protecting downstream circuits and improving system safety and reliability.

The lineup includes auto-retry models, which automatically restore circuit operation, and latch-type models, which require an external signal to recover. Different slew-rate settings are also available to meet power sequencing requirements.

Toshiba said it would continue expanding its eFuse IC lineup to support a wider range of equipment.

-- BERNAMA

GOING ASSET MANAGEMENT BAGS CAPITAL EXCELLENCE FUND AWARD

KUALA LUMPUR, Oct 12 (Bernama) -- Going International Asset Management Limited has received the Capital Excellence Fund Award at the Capital Merits of Achievement in Banking and Finance 2026 for its financial technology innovation, quantitative strategy research and development capabilities, and fund performance.

According to a statement, the award honours Going Asset’s strengths in asset management and its technology-driven approach, following the announcement of the winners by financial publication Capital Magazine on Sept 29.

The awards recognise financial institutions that have contributed to the development of Hong Kong’s financial sector. Winners are selected based on criteria including overall performance, service quality and reputation.

Now in their 17th consecutive edition, the awards have also recognised institutions such as BOC-Prudential Asset Management, CCB International, Dah Sing Bank, Hang Seng Investment Management Limited and Nanyang Commercial Bank.

Going Asset Management uses artificial intelligence (AI)-driven high-performance computing and ultra-low-latency systems to identify cross-market price movements within microseconds. The approach aims to accumulate small gains across a large volume of trades and improve asset allocation efficiency across market cycles.

The firm’s assets under management have exceeded US$3.3 billion (RM13.46 billion). According to Morgan Hedge rankings as of Aug 31, 2026, its Going Algo SP 2-Class M Fund recorded returns of 89.44 per cent over one year and 280.64 per cent over three years, ranking first globally in both periods. (US$1 = RM4.08)

The company has also expanded its use of AI, with large models processing real-time information streams and improving through reinforcement learning to support investment research and trading strategies.

Going Asset Management plans to continue prioritising AI and risk management while expanding its quantitative research and development across global markets, leveraging Hong Kong’s role as a link between international capital markets.

The firm aims to provide global investors with more resilient portfolios and asset allocation solutions through stronger strategies, greater operational transparency and higher compliance standards.

-- BERNAMA

Friday, 9 October 2026

KIOXIA UNVEILS HIGH-DENSITY SSD FOR HYPERSCALE DATA CENTRES



KIOXIA LD4 Series Data Center SSD



KUALA LUMPUR, Oct 9 (Bernama) -- Kioxia Corporation, a global memory solutions provider, has announced its first E1.L form factor solid-state drive (SSD) built with eighth-generation BiCS FLASH quad-level cell (QLC) flash memory.

Amid growing data demand, including from artificial intelligence (AI), hyperscale data centres are increasingly adopting high-density designs to maximise storage capacity within limited server space, according to Kioxia in a statement.

Designed for high-density 1U servers and read-intensive storage applications, the KIOXIA LD4 Series is currently being sampled to select customers and will be showcased at the 2026 OCP Global Summit in San Jose, California, from Oct 12 to 15.

The series supports PCIe 5.0 and the NVMe 2.0e specification, and complies with the Open Compute Project (OCP) Datacenter NVMe SSD Specification v2.6.

It features a single-port design and is available in 15.36-terabyte (TB) and 30.72 TB capacities, with an architecture validated to support capacities of up to 122.88 TB.

Kioxia is dedicated to the development, production and sale of flash memory and SSDs. The company's BiCS FLASH 3D flash memory technology supports storage applications across data centres, smartphones and automotive systems.

-- BERNAMA

Thursday, 8 October 2026

HELICAL FUSION RAISES ABOUT US$20.6 MLN IN SERIES B SECOND CLOSE

 

Helical Fusion and new investors for the Series B 2nd close


KUALA LUMPUR, Oct 8 (Bernama) -- Helical Fusion Co Ltd, a fusion energy company, has announced the completion of a 3.23 billion Japanese yen (approximately US$20.6 million) Series B second close (US$1 = RM4.08).

The round marks another expansion of the industrial coalition forming around Helical Fusion’s Helix Program, with Japanese electrical and industrial equipment manufacturer Fuji Electric Co Ltd joining as an investor and Official Partner of the Helix Program.

In a statement, Helical Fusion said Fuji Electric’s participation represents a significant expansion of the industrial capabilities being brought into the Helix Program.

Through the new capital and business alliance, the companies will broaden their collaboration towards the development of products, services, and advanced technologies required for future fusion power systems.

“The Helix Program is steadily moving forward. At the Helix HARUKA construction site, our team and industrial partners are working together every day to turn fusion technology into real hardware.

“The participation of Fuji Electric and other leading companies across Japan’s energy and industrial sectors further strengthens the foundation for building a new energy industry,” said Helical Fusion Co-Founder and Chief Executive Officer, Takaya Taguchi.

Other new investors in the second close include Hazama Ando Corporation, Fujikura Ltd, Tokyo Gas Co Ltd, KKT LLC, and URATA Co Ltd. The round also included investments from Ecrowd NEXT, a fund designed for individual investors, alongside multiple corporate and individual investors.

Together with other funding, including the Gifu Prime Startup Support Subsidy administered by the Gifu Prefecture Industrial Economic Promotion Center, Helical Fusion’s cumulative funding has reached approximately 13.15 billion Japanese yen (approximately US$83.8 million), including grants and loans.

The new capital will accelerate the Helix Program, Helical Fusion’s development roadmap towards integrated demonstration with Helix HARUKA and subsequent net-electricity generation with Helix KANATA, its first fusion power plant, in the 2030s.

-- BERNAMA

RegASK Expands Enterprise Regulatory AI Ecosystem Through Microsoft Marketplace

 

Life sciences and consumer products companies can now discover and deploy RegASK through Microsoft Marketplace, simplifying access to regulatory decision intelligence and agentic AI workflows.


NEW YORK & SINGAPORE, Oct 8 (Bernama-BUSINESS WIRE) -- RegASK today announced the availability of its AI-native regulatory platform in the Microsoft Marketplace, the unified online destination for customers to buy trusted cloud solutions, AI apps, and agents to meet their business needs. RegASK customers can now discover and deploy trusted solutions through Microsoft Marketplace, with smooth integration and streamlined management across Microsoft Azure and other Microsoft products.

For organizations already operating within the Microsoft ecosystem, Marketplace availability provides an established route to access RegASK through existing enterprise technology and procurement environments. Where eligible, customers can also apply purchases toward existing Microsoft Azure consumption commitments.

As regulatory AI moves from individual use cases toward enterprise-wide adoption, value increasingly depends on how AI connects with the systems, data, governance, and workflows organizations already rely on. RegASK is designed as the regulatory decision intelligence and action layer across that ecosystem, connecting external regulatory change with customer-specific context, analysis, decision support, and execution.

Powered by vertical AI purpose-built for regulatory operations, RegASK combines domain-specific models, specialized regulatory AI agents, and human expertise within a governed environment. Source traceability and human oversight remain embedded where regulatory judgment, validation, or approval is required.

“Enterprise adoption of regulatory AI is increasingly an ecosystem question. Vertical AI cannot operate in isolation. The next phase is about embedding it into the systems, governance, and workflows through which regulatory decisions are made and executed,” said Caroline Shleifer, founder and CEO of RegASK. “Microsoft Marketplace extends that enterprise ecosystem for RegASK, helping organizations bring regulatory decision intelligence and agentic execution into a connected, governed operating model.”

“We’re pleased to welcome RegASK to Microsoft Marketplace,” said Cyril Belikoff, vice president, Microsoft Azure Product Marketing. “Marketplace connects trusted solutions from global partners with customers worldwide, making it easy to find and deploy apps that work seamlessly with Microsoft products.”

Microsoft Marketplace is a single destination to find, try, and buy trusted cloud solutions, AI apps, and agents to meet your business objectives. Choose from a growing collection of solutions tailored to your unique needs, available both in Marketplace and directly within Microsoft products.

About RegASK

RegASK is the AI-native regulatory platform for life sciences and consumer products companies. The platform anticipates regulatory change, assesses portfolio impact, and acts across compliance workflows in more than 160 markets, drawing on a global community of more than 1,800 subject-matter experts. RegASK serves more than 80 companies, is a Veeva AI partner, and is available in Microsoft Marketplace. RegASK holds five independent certifications spanning AI governance, security, and privacy, including ISO/IEC 42001 for AI Management Systems, alongside GDPR compliance and an EcoVadis sustainability rating. To learn more about RegASK, visit regask.com.

View source version on businesswire.com:
https://www.businesswire.com/news/home/20261007872021/en/

Contact

For more information, press only:
Reva Ananda, RegASK
Head of Content & Communications
reva.ananda@regask.com
+65 6817 6290

Source : RegASK

Tuesday, 6 October 2026

AM INTELLIGENCE ORDERS 20,000 NVIDIA RUBIN GPUS FOR INDIA, MALAYSIA

 

KUALA LUMPUR, Oct 6 (Bernama) -- AM Intelligence (AMI), the artificial intelligence (AI) infrastructure platform set up by the promoters of Greenko, has announced two further firm and binding orders for 20,000 NVIDIA Rubin graphics processing units (GPUs) to be deployed as NVIDIA Vera Rubin NVL72 rack-scale systems.

Building on its first AI factory in Hyderabad, India, the expansion is designed to give cloud providers, enterprises and AI developers access to large-scale computing capacity closer to where they build and deploy AI.

These orders are in addition to AMI's inaugural commitment announced on Aug 25 for 9,000 NVIDIA Rubin GPUs at its first AI factory in Hyderabad. The follow-on capacity, totalling approximately 70 megawatts (MW), will be deployed in Malaysia and India, with delivery scheduled for the second quarter of 2027.

“Both facilities will be built to the same architecture standard as the Hyderabad AI Factory, integrating the NVIDIA Vera Rubin platform with high-throughput RDMA over Converged Ethernet (RoCE) networking for fast, efficient data movement, alongside advanced storage systems.

“Each site is engineered for high rack power density and liquid cooled throughout, allowing the infrastructure to accommodate successive generations of AI silicon within the same physical footprint,” said AMI Chairman, Anil Chalamalasetty in a statement.

Taken together, the three orders bring AMI's committed frontier compute to approximately 29,000 Rubin GPUs and close to 100 MW of capacity.

AMI said it plans to bring an additional 300 MW of capacity to market over the next 15 months, involving capital expenditure of more than US$20 billion. (US$1 = RM4.08)

The company has developed a pipeline of approximately 400 MW of Compute-as-a-Service capacity across global locations, including India, the United States, Europe and Malaysia. The three orders placed to date represent the first committed tranche within that pipeline, while the balance is under development for delivery in subsequent phases in 2027 and early 2028.

The pipeline advances AMI's stated intention to bring one gigawatt (GW) of Compute-as-a-Service capacity to global AI workloads, within a broader programme of five GW of powered AI data centres.

-- BERNAMA