KUALA LUMPUR, March 23 (Bernama) -- Polyplastics Co. Ltd., a global supplier of engineering thermoplastics, has unveiled a new series of low-dielectric liquid crystal polymers (LCPs) for next-generation communication devices.
Polyplastics, in a statement, said the new LCP series known as LAPEROS (R) E420P, is the first low-dielectric grades which also possess inherent high heat resistance, mechanical properties, chemical resistance, high flow and low warpage for films and connectors in cabling, antennas and circuit boards.
As the demand increased, the company developed the new series to satisfy the needs of 5G telecommunications and V2X telecommunications for autonomous automobiles and materials applicable for high-speed and high-frequency transmission components.
Using an optimum combination of filler and formulation technology, LAPEROS (R) E420P achieves a low-dielectric constant of less than 3.0 measured perpendicular to the flow direction for the 1-20 GHz frequency band.
The material also fulfils downsizing requirements and increasingly complex designs in connector applications and can be used in surface-mount technology processes.
Polyplastics plans to extend its product portfolio to include grades with enhanced low warpage, higher heat resistance, greater flow for compact and fine-pitched connectors.
LAPEROS (R) is a registered trademark of Polyplastics Co. Ltd. in Japan and other countries.
The company has the largest global market share of polyoxymethylene and LCPs. With more than 50 years of experience, Polyplastics is backed by a strong global network of research and development, and production and sales resources capable of creating advanced solutions for an ever-changing global marketplace.
For more information, visit www.polyplastics.com/en/product/lines/lcp_e420p/index.vm.
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