KUALA LUMPUR, June 21 (Bernama) -- TriLumina Corporation has launched the world’s first surface-mount flip-chip back-emitting vertical-cavity surface-emitting laser (VCSEL) array without the need for a submount or bond wires.
TriLumina is the leading developer of flip-chip VCSEL technology for 3D sensing.
The new device allows for lower costs and higher performance compared to existing designs using near-infrared light-emitting laser diodes or LEDs for 3D sensing.
TriLumina's chief marketing officer, Luke Smithwick, said for the first time, engineers can create extremely small, low-cost, high-performance products utilising a NIR surface mount back-emitting VCSEL array, without the need for a large and costly submount.
The tiny, very low-cost illumination technology is an excellent solution for numerous 3D sensing applications, as well as providing innovative NIR illumination options for replacing existing LEDs in solutions such as NIR camera systems, mobile cameras, in-cabin occupant monitoring and AR/VR systems.
This new architecture from TriLumina also has excellent thermal properties with a very compact form factor.
-- BERNAMA
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