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| 300mm wafer type HRDP® products (In a special case for shipping products) (Photo: Business Wire) |
KUALA LUMPUR, May 15 (Bernama) -- Mitsui Mining and Smelting Co Ltd (Mitsui Kinzoku) and GEOMATEC Co Ltd (GEOMATEC) collaborated to establish a mass production system for the commercialisation of High Resolution Debondable Panel (HRDP), a specialty carrier for next-generation semiconductor packaging.
In a statement, Mitsui Kinzoku announced it has decided to invest in a second production line in GEOMATEC’s Ako plant, scheduled to start operation in 2025, to increase production capacity and expand the Design of Experiments (DOE) facility.
At the same time, GEOMATEC will invest in the thin-film process used on this second line.
Currently, several major semiconductor companies have begun the full-scale development of their next-generation semiconductor packages using HRDP, which was developed by Mitsui Kinzoku.
In addition, by expanding the DOE facility already in operation, the company will accelerate joint development with major semiconductor companies using HRDP, enabling customers to shorten cycle times.
With the installation of the second line and the expansion of the DOE facility, it will be able to respond quickly to the increasing demand for development and move toward the adoption of HRDP and the expansion of its use in mass production in the next-generation semiconductor market in the future.
This capital investment will be made in steps from 2023 to 2025. Mitsui Kinzoku will contribute to the semiconductor packaging market by expanding its HRDP business and contribute to the creation of a sustainable society through its business activities.
-- BERNAMA
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