Addresses Data Storage Demands, Including Increased Performance and Capacity, Required by Connected and Autonomous Vehicle Applications
TOKYO, March 26 (Bernama-BUSINESS WIRE) -- Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun sampling[1] new Automotive JEDEC UFS[2] Version 2.1 embedded memory solutions utilizing 3D flash memory. The new products are embedded flash memory devices that integrate the company’s BiCS FLASH™ 3D flash memory and a controller in a single package. The sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over existing devices[3].
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The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2[4] requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32GB, 64GB, 128GB, and 256GB[5].
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