TOSHIBA MEMORY CORPORATION ADDS BICS FLASH ENABLED UFS TO LINEUP OF EMBEDDED FLASH MEMORY PRODUCTS FOR AUTOMOTIVE APPLICATIONS

Addresses Data Storage Demands, Including Increased Performance and Capacity, Required by Connected and Autonomous Vehicle Applications
 
TOKYO, March 26 (Bernama-BUSINESS WIRE) -- Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun sampling^[1] new Automotive JEDEC UFS^[2] Version 2.1 embedded memory solutions utilizing 3D flash memory. The new products are embedded flash memory devices that integrate the company’s BiCS FLASH™ 3D flash memory and a controller in a single package. The sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over existing devices^[3].
 
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The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2^[4] requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32GB, 64GB, 128GB, and 256GB^[5].

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